Advanced Packaging Multi-Physics Modeling Engineer

ABOUT THE TEAM: OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. ROLE OVERVIEW: We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions. The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms. IN THIS ROLE YOU WILL:... Click Apply to read the full job description.